Our Product
High Performance Heat Sinks
Thermal management at chip and system level plays a vital role in ensuring the high performance and reliability of critical systems. With the expertise in thermal management domain, we collaborate with customers to offer custom made heat sink solutions for various applications.
Features
- Very thin fins and very high fin density
- Material: CU/AL
- Larger surface with the same volume
- High thermal conductivity
- Soldering / Vacuum brazed / Thermal
- Adhesive bonding technology
- Suitable for conduction and convection cooling